東京精機工作所
     
Tokyo Seiki Kosakusho Co., Ltd.  
社長 President-: Yoshiteru Komino  
 

We always kept forward investment and research & development to respond to the customer's request.
Please talk about anything of processing.
Our machine tools will give you precision improvement and efficiency in a manufacturing process of your company by all means.

 

 
◆ Company profile ◆
 
Company name
  Tokyo Seiki Kosakusho Co., Ltd.
Establishment
  13 June, 1961  
Capital
  50,000,000 yen  
Location
  ■ Head Office・The first factory  2-6-1 Honhaneda, Oota-ku, Tokyo 144-0044
■ The second factory       5-5-22 Higashikoujiya, Oota-ku, Tokyo 144-0033
■ The third factory        1-19-12 Honhaneda, Oota-ku, Tokyo 144-0044
Representative
  Chairman:Shogo Komino  Preseident and CEO:Yoshiteru Komino
Map
  Map  
for Enquiries
  Email:tskk@k-tsk.co.jp / Phone:+81-3-3744-0809 / Fax:+81-33-3743-1560
Bankers
  Bank of Tokyo-Mitsubishi UFJ / Mizuho Bank Ltd. /Shoko Chukin  
Business Summary
  Development, design, production, sale, maintenance of machine tools (general-purpose and special-purpose)
     

     
Products
  ■ General or Special-purpose Grinder, Cutting machine and Polishing machine / Storage and Transfer device associated with them.
Materials of processing work
 

■ Various steel materials, special steel materials, sintered metal and others
■ Various non-ferrous materials
Sapphire /SiC/ neodymium /GaN/ ceramics / single crystal silicon / polycrystalline silicon / gallium arsenide / quartz glass / glass / crystal / carbon / germanium / ferrite and others

Field at Delivery Destination
  ■ Grinding and cutting of the silicon for solar cell
■ Grinding and cutting of the sapphire
■ Grinding and cutting of SiC
■ Sylindrical Grinding of Silicon Ingot (OF, V-notch), Band-Sow Cutting and OD-Sow Cutting.
Groove Processing for Wafer Boat. (Quartz Glass, Ceramics)
Cutting for Lens Glass of Camera and Prism.
Slit Groove Processing of Vane Pump Rotor.
Groove cutting and grinding of brake pad for motorcycle
Circumferential Chamfering, Grinding and polishing for Photomask(Quartz Glass)
Grinding and Cutting for Magnet of PC, Digital Camera, Cell-phone, Magnet of Motor(Ferrite, Neodym,)
■ Blade Grinding (circle blade, shirring blade, for vendor)
■ Sylindrical Grinding, Orientation Flat Grinding, Core Drilling, End Surface Grinding and Grinding befor Lapping for Material (sapphire, germanium)
©2013 TOKYO SEIKI KOSAKUSHO Co., Ltd. / TSK SERVICE Co.,Ltd.