TSKK
TSKK's Products
  Al2O3 SiC SiO2 Si 太陽電池 ガラス 医療器具
◆Products ◆
We provide machines that allow processing under optimum conditions by using general grinding and superabrasive wheel.
Custom-made specialized machines that accommodate constantly evolving products have been receiving very good reputation from users of varied industries.
 
◆All Lineup of TSKK Machines
 
slice rotary special
uni-purpose solor sapphire

 

1.Slicing Machines

 

Model Processing work and feature
TS-4020SM TS
Slicing Machines
Best-selling machine of TSKK. It utilizes diamond wheel to cut and groove, with high precision, special materials and those hard to grind including glass, ferrite, ceramics, cemented carbide and neodymium.
2.Rotary Grinding Machines

 

Model Processing work and feature
TR-60NC TR
Rotary Grinding Machines
It grinds materials such as iron and ceramics. With uniqueness of Mackensen-type metal support horizontal spindle, it enables grinding with its superior rigidness.
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3.Special Purpose Machines

 

Custom-made specialized machine for cutting-edge areas We also provide custom-made specialized machines that meet customer's needs. We cover wide-ranging areas from parts processing, for example, for hybrid cars components, and also cutting/grinding of leading-edge materials such as sapphire.
Model Processing work and feature
BSM BSM
Bandsaw Cutting Machine
Cutting and processing of silicon and quartz glass and others various materials.
CSN8022 CSN 
Cylindrical Grinding Machine
Cylindrical grinding and orientation flat processings such as silicon, quartz glass, indium, gallium arsenic, sapphire and germanium.
TSA-50150 TSA 
Large Slicing Machine
Rectangular table type / 3 axis NC
This equipment has achieved many results ranging from the groove processing of the wafer boards, cutting of and cutting groove of hard materials.
TSA-550 TSA 
Medium Slicing Machine
Circular table type / 4 axis NC
It is best suited to the precise cutting of a thin plate such as ceramic and glass.
TSA-4040V TSA 
Circumferential Chamfering, Grinding Machine
3 axis NC
Slit Groove Processing of Vane Pump・Rotor.
TSG-2 TSG 
Auto Slit Grinding Machine
Automatically grind grooves such as slit on the rotor of vane pump.
4.Machines for the Silicon Ingot for Solar Cells

 

We provide various processing machines that combine slicing and grinding for multiprocess of ingot used in silicon crystal-type solar panels in the solar cell category.

◆SEED(SLIMROD)PROCESSING MACHINES FOR POLY SILICON

PROCESSES MODELS
1.Top / Tail Cutting for As Grown Ingot (Single OD-Saw) GSZBSM
2. Cutting for Ingot Longitudinal Direction (Single OD-Saw) Custom-made
3. Multi Cutting for Squaring (Multi OD-Saw) Custom-made
4. Cutting for Bridge Plate (Single OD-Saw) Custom-made
5. Hole Making / Grinding (Cup Wheel) Custom-made
6. Seed Taper Grinding (1-axis or 2-axis) Custom-made

◆MACHINES FOR MONO CRYSTALLINE SILICON INGOT

PROCESSES MODELS
1. Top / Tail Cutting for As Grown Ingot (OD-Saw、Band Saw) GSZBSM
2. Squaring(OD-Saw) MCS
3. Corner R Grinding(Cup Wheel) MCS
4. Grinding &Finishing for 4-Surface (Cup Wheel) TSW
5. Block Cutting (OD-Saw、Band Saw) GSZGHSBSM

◆MACHINES FOR MULTI CRYSTALLINE SILICON INGOT

PROCESSES MODELS
1. Squaring(Single OD-Saw、Band Saw) GHSBSM
2. Top & Tail Cutting (OD-Saw、Band Saw) GHSBSM
3. Grinding for 4-Surface &Chamfering for 4-Corners (Mainly Cup Wheel) TSW
4. Accuracy Modificating against NG Ingot TSF
5. Surface Micro Finishing (Cup Wheel) TSW

Suggestion for Full-Turn Key Operation Plant
 It is not only Machines but also Ingot Carrying system, such as Conveyor & Full-Auto-Strage

  Model Processing work and feature
BSM640L3-P2.jpg BSM 
Band Saw Machine
Cutting materials such as silicon ingot and quartz glass.
GSZ15020NC.jpg GSZ 
OD Saw Machine
for Mono crystalline silicon
Top / Tail Cutting for As Grown Ingot.
Block Squaring for Mono Crystalline Ingot.
GHS8040-2H GHS 
OD Saw Machine
for Multi crystalline silicon
Top / Tail Cutting for suqare multi clystalline ingot.
TSW4020FC TSW 
Surface & Coner
Grinding Machine
Performing 4flat and 4corner grinding of the square multi clystalline ingot.
TSF TSF
Full Automatic Edge Surface Grinding machine
This machine is a specially designed to grind one edge surface of mono and multi crystalline silocon ingot.
Combined machining machine MCS 
Square Cutting, Corner & Surface Grinding Machine
This machine(5 head type) is combined, 3-in-1 machine which is controlled by NC and performed each process in square cutting, surface grinding and sylindrical grinding with one chucking clamper. (The combination of the number of heads can be changed.

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