株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

GSZ
High speed model GSZ O/D-Saw cutting machine for mono cristalline Si
This machine is developped to cut the TOP/Tail of As Grown Ingot & Block before wire sawing process. There are many advantages in comparison with conventional cutting machine for this purpose, such as Veery Simple & com;act! High Cost Performance! Reasonable Accuracy! and High Speed Cutting! Also very competitive running cost persofrmance will be comfirmed by customers.

Specification

Acceptable Work Size (mm) Spindle Motor(kW) Spindle Numbers
GSZ15020NC Max. 220×150 5.5 1
GSZC25035-3AT Max. 220×150 5.5 1

Process

Cutting

Work piece

Silicon ingot
Quartz glass

Feature

  • There are two type models, one is sinply designed Head/Column fixed type,another is designed Head/Column shiftable type for compact design.
  • Cutting speed is seved faster than conventional machine, shich is 15~35mm/min.
  • Simple construction & High Cost Performance.

株式会社東京精機工作所

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  • JP