株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TVSF20020NC-2PH
CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine
This machine can grind the surface of the large corner blade and a slant blade side in two kinds of whetstones.

Specification

Processing target mm Max (lateral direction):2000
mm Max(anteroposterior direction):200
mm Max(height direction):100
Wheel size(outer diameter) Main mm 255
Sub mm 125
Motor power Main kW 11/4p
Sub kW 5.5/2p
Mass of basic unit Kg 8000

株式会社東京精機工作所

  • サポートのご相談
  • JP