株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TVSF30030NC
Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Specification

Size of the chuck upper surface (length×width) mm 3050×350
Height from the floor to the top of the table mm 900
Feeding wheel outer diameter mm 300(Max450)
Longitudinal travel of table mm 3500
Feeding wheel head vertical movement amount mm 350
Machine weight kg 12000

株式会社東京精機工作所

  • サポートのご相談
  • JP