株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TR30A
Horizontal Spindle type Rotary Grinding Machine
It grinds materials such as iron and ceramics. With uniqueness of Mackensen-type metal support horizontal spindle, it enables grinding with its superior rigidness.

Specification

Diamerter of electromagnetic chuck mm 310
Effective aperture of electromagnetic chuck mm 276
Maximum swing of cover inside mm 450
Maximum distance between lower surface of new wheel and chuck surface mm 100
Vertical displacementof wheel axis mm 190
Tilting angle of chuck table ±5゜
Size of wheel (O.D.×thickness×I.D.) mm 255×25×76.2
Revolution of wheel mln-1 2300
Longitudinal travel of table mm 250
Feeding speed of table (nonstep) mm/min 300~2500
Revolution of table(nonstep) mm-1 50~280
Machine weight Kg 1500

株式会社東京精機工作所

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