株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TS5020SMA
Slicing Machine
*This image is [TS4020SM].
Best-selling machine of TSKK. It utilizes diamond wheel to cut and groove, with high precision, special materials and those hard to grind including glass, ferrite, ceramics, cemented carbide and neodymium.

Specification

Size of the chuck upper surface (length×width) mm 500×200
Table stroke (left to right×front to back) mm 520×200
Distance from wheel axis to the table upper surface mm 270
Distance of manually moving wheel axis vertically (handle) mm 100
Distance of automatically moving wheel axis vertically (hydraulic) mm 50
Size of wheel (O.D.×I.D.) mm 100~180×40
Speed of feeding the table left and right mm/min 1~1500
Speed of rapidly feeding the table left and right mm/min 1500(3000MAX)
Feeding wheel axis vertically (handle 1 revolution) mm 0.4
Feeding wheel axis vertically(1 graduation) mm 0.01
Revolving speed of wheel axis mm-1 MAX.7000
Motor power for wheel axis; Max. power in parentheses Kw 3.7(7.5)
Mass of the basic unit kg 1500

株式会社東京精機工作所

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