株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TSW
Full automatic silicon surface and corner chamfering 4-head gringind machine
This is a grinding processing machine specially designed to perform 4 flat and 4 corner grinding of the square multi crystalline silicon.
Consisting of auto-loading /unloading devece, in/out conveyer with workpiece-stand and gauging system for auto-compensating a rough grinding to a finish grinding can be processed by one machine with 4-head wheels.

Specification

Acceptable Work Size (mm) Spindle Motor(kW) Spindle Numbers
TSW4020FC-2H Max. 156×L210 7.5 2
TSW4020FC-4HAT Max. 156×L400 About 7.5, finish5.5 4

株式会社東京精機工作所

  • サポートのご相談
  • JP