株式会社東京精機工作所

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株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TSG6025
Automatic Slit Grinding Machine(with NC device)

Specification

Table size mm 1,310×250
Size of wheel(O.D.) mm 355
Revolution of wheelaxis mln-1 300~2,500
Moter power for wheel axis kW 5.5
Work loader / unloader stocker Discussed upon request
Foot space size mm Approx.4,600×2,662
Mass of basic unit kg 5,500
This specifications descibed above are of a typical example.

Process

Grinding

Work piece

Grooving

Feature

  • ?This equipment is grinding machine that can automatically grind grooves such as a slit on the rotor of a vane pump.

株式会社東京精機工作所

  • サポートのご相談
  • JP