株式会社東京精機工作所

  • サポートのご相談
  • JP

株式会社東京精機工作所

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Cylindrical Grinding Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Categories

Horizontal Spindle type Rotary Grinding Machine

Vertical Spindle type Rotary Grinding Machine

CNC Vertical Axis Type Reciprocating Flat Surface Grinding Machine

Slicing Machines

Others

Bandsaw Cutting Machine
Large Slicing Machine
Medium Slicing Machine
Circumferential Chamfering, Grinding Machine
Auto Slit Grinding Machine
Machines for the Silicon Ingot for Solar Cells
Full-Turn Key Operation Plant
Semiconductor related products
Please inquiry us.

Product information

TSA550
Circular table type slicing machine(with the 4 Axes NC)

Specification

mm X axis
(L/R table Feed)
Y axis
(F/B Wheel Head Feed)
Z axis
(U/D Wheel Head Feed)
Stroke mm 650 400 100
Feeding Speed for Cutting mm/min 1~7,500 1~6,000 1~1,500
Rapid Feeding Speed mm/min 7,500 6,000 1,500
Minimum Movement Unit mm 0.001 0.001 0.001
Tble Size mm 550
Wheel Size(O.D.×I.D.) mm 125~200×40
Revolution of Wheel(variable) mln-1 1,000~7,000
Motor Output for Wheel axis kW 3.7
Foot Space Size mm About 2,500×2,200
Mass of Basic Unit kg About 3,500

Process

Cutting

Work piece

It is best suited to precise cutting of a thin plate such as ceramic, glass, carbon and wafer boat.

Feature

  • This equipment is a gate and circular table type large slicing machine with 4 axis(x. y. z. and θ axis)NC device. It is used in various fields such as cutting a substrate.。

株式会社東京精機工作所

  • サポートのご相談
  • JP